Lead Free Wave Flux (EF-0008)

Product Description

Low rosin lead free wave flux EF-0008 is a resin containing flux designed to provide the excellent solderability and reliability in in general and high-density boards in both Lead Free and lead soldering processes. It is designed to to have low bridging on bottom side QFP's with 144 -168 leads as well as superior performance in hole fill and solderballing. Additionally, it provides good Lead Free solder joint cosmetics with an evenly spread, tack free residue.

FEATURES & BENEFITS
*Features for lead free Free
*Good hole-fill demonstrated by >96% yield on 10 mil holes.
*Low bridging performance on connectors.
*Good micro-solder ball performance in Lead Free applications.
*Pin testable Benefits:
*Excellent Lead Free soldering performance on various board finishes.
*Evenly spread, tack free residue.
*Capable for high density as well as general purpose lead free soldering processes.
*Can be used in lead free or lead processes.

APPLICATION GUIDELINES PREPARATION: In order to maintain consistent soldering performance and electrical reliability, it is important to begin the process with circuit boards and components that meet established requirements for solderability and ionic cleanliness. It is suggested that assemblers establish specifications on these items with their suppliers and that suppliers provide Certificates of Analysis with shipments and /or assemblers perform inspection. Analysis with shipments and/or assemblers perform incoming inspection.

EF-0008 can be applied by spray or foam. When spray fluxing, the uniformity of the coating can be visually checked by running a piece of cardboard over the spray fluxer or by processing a board-sized piece of tempered glass through the spray and then through the preheat section.